INTRODUCTION Due to the difference in thermal expansion coefficients of carbide composite phases and manufacturing process peculiarities, the presence of high residual stresses, both tensile and compressive, is a common feature for these materials.
What does TEC stand for?
TEC stands for Thermal Expansion Coefficient
This definition appears very frequently and is found in the following Acronym Finder categories:
- Science, medicine, engineering, etc.
See other definitions of TEC
We have 467 other meanings of TEC in our Acronym Attic
- The Entrepreneurship Center
- The Environmental Company, Inc (Annapolis, MD)
- The Episcopal Church
- The Eternal City (game)
- The Experts Conference (computing)
- Theatre Enabling Command (medical care; US DoD)
- Therapeutic Equestrian Center (various locations)
- Thermal Efficiency Construction
- Thermal Electric Control
- Thermal Engineering Corporation
- Thermionic Energy Conversion
- Thermo-Electric Cooler
- Thermoelectric Cooling
- Threatened Ecological Community (Australia)
- Threshold Effects Concentration
- Threshold Exceeds Condition
- Thymic Epithelial Cell
- Thyroid Epithelial Cell
- Tibet Empowerment Circle (nonprofit NGO supporting education and empowerment for Tibetans)
- Tilganga Eye Centre (Nepal)
Samples in periodicals archive:
decomposition temperature, modulus of elasticity, thermal expansion coefficient, specific heat, thermal conductivity and density and is available free from the company's website.
Such movement is caused by the differences in thermal expansion coefficients between the copper barrel that forms the plated through-hole, and the epoxy-based material located between these joints.
Thermal warping resulting from aluminum's thermal expansion coefficient (twice that of steel) is countermeasured with a longitudinal design bead that essentially absorbs the differences.
38) Thermal expansion coefficient of carbon black filled rubber compounds around Tg correlation with electrical resistivity.
That's important," Wool explains, "because a high thermal expansion coefficient can damage printed circuits and lead to brittleness and durability issues.
Due to the different thermal expansion coefficients of silicon and nickel a thermal (tensile) strain develops in the nickel layer during cooling down.