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What does UBM stand for?

UBM stands for Under-Bump Metallization

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We have 53 other meanings of UBM in our Acronym Attic

Samples in periodicals archive:

Utilizing technology from Novellus' industry-leading SABRE Electrofill copper damascene interconnect system, SABRE 3D's flexible and modular architecture delivers a range of high-productivity WLP processes, including copper through-silicon vias (TSV), copper redistribution layers (RDL), pillars, under-bump metallization, and lead-free micro-bumping.
First Back-end Customer Will Deploy SEZ's Single-wafer Wet-processing Technology for Solder Bump Applications Marking the latest milestone in its efforts to expand its market-leading single-wafer wet processing technology throughout the entire IC manufacturing process, the SEZ Group today announced it has entered the back-end under-bump metallization (UBM) etch market.
Low stress films are widely utilized in backside metallization for power and discrete devices, under-bump metallization applications, advanced packaging, high-brightness light emitting diodes (HB-LEDs), and in creating electro-acoustic devices for BAW, FBAR, and RF MEMS applications.
Low stress films are widely utilized in backside metallization for power and discrete devices, under-bump metallization applications, advanced packaging, photo masks (including EUV), high-brightness light emitting diodes (HB-LEDs), and in creating electro-acoustic devices for FBARs and RF MEMS.
The system is targeted at 200mm semiconductor applications such as backside metallization, thin-wafer processing, under-bump metallization, multilevel interconnects, and bulk acoustic wave resonators while combining physical wafer deposition, plasma enhanced chemical vapor deposition and soft-etch cleaning technologies.