The updated standard includes differences for tin-lead and lead-free solder paste, overprint, two-print and step stencil designs.
What does SnPb stand for?
SnPb stands for Tin-Lead (Solder)
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- Syndicat National des Plastiques Alvéolaires (French: National Union of Foamed Plastics)
- Syndicat National des Prestataires de Services d'Accueil (French: National Association of Home Service Providers)
- School Nutrition and Physical Activity Advisory
- Syndicat National des Producteurs d'Alcool Agricole (French)
- Syndrome of Nonprimary Acute Abdomen
- Swedish Number Portability Administrative Center
- Sistema Nacional de Prevención y Atención de Desastres (Spanish: National System for Disaster Prevention and Response; Columbia)
- Swedish National Police Board
- Swedish National Property Board
- Syndicat National du Pompage du Béton (French: National Union of Concrete Pumping)
- Syndicat National des Pharmaciens et des Biologistes Assistants des Hôpitaux (Paris, France)
- Satin Nickel/Polished Chrome
- Scottish National Photography Centre (UK)
- Scripted Non-Playable Character (video games)
- Secretariado Nacional da Pastoral da Cultura (Portugese)
- Service National des Permis de Conduire (French: National Service Driving License)
- Serviço Nacional De Protecção Civil (Portugal)
- Shanghai Nanotechnology Promotion Center (China)
- Southern Nevada Paddling Club
- Substantia Nigra Pars Compacta
Samples in periodicals archive:
For more than 60 years the electronics industry has relied on tin-lead solder as the primary bond between electronic devices.
Transition of these types of assemblies was straightforward, as the process settings did not significantly differ from the tin-lead parameters.
The standard termination for all surface mount Tantalum-MnO2 and Organic Polymer KO-CAP products will be changed from tin-lead to 100% matte tin.
The primary Pb-free finish used by this company is pure matte tin, which provides stable plating compatible with existing tin-lead solder processes.
Thus, the material can be used in surface-mount technology (SMT) with lead-free solders, which are processed at 260 C, or about 30[degrees] C higher than for conventional tin-lead solders.
Several industries have identified needs for solders that perform reliably at ever-higher temperatures, temperatures which approach the melting point of the industry-standard tin-lead eutectic alloy ([T.
The 630V range is available in RoHS, tin-lead terminations and FLEXITERM([R]) versions.