What does TSSOP stand for?

Thin Shrink Small Outline Package

This definition appears very rarely

Other Resources:

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Samples in periodicals archive:

The IDT thin shrink small outline packages (TSSOP) integrate Unisem's copper wirebonds for a wide range of applications, including clock devices for desktops and notebook PCs.

Unisem Begins Volume Production of Packages Using Proprietary Copper ...

5 V maximum supply voltage range --Heatsink Thin Shrink Small Outline Package (HTSSOP) with under-belly thermal pad --EL5524 in 14-lead, EL5624 in 20-lead, EL5724 in 24-lead, EL5824 in 28-lead Availability and Pricing Intersil's EL5524 and EL5624 are available now.

Intersil Introduces New Multi-Channel Gamma Buffers with Integrated ...

FCOSL packages are available in small outline integrated circuits (SOIC), thin shrink small outline package (TSSOP), and quad flat package (xQFP) configurations.

Advanced Interconnect Technologies Qualifies Robust Green --FC-SOIC-- ...