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Samples in periodicals archive:
5mm pitch thin small outline package (TSOP) Flash memory components for higher-capacity, low-cost Flash storage applications.
3V power supply and are packaged in a standard 48-pin thin small outline package (TSOP) for easy integration into most existing designs.
All of the devices offer outstanding ac and dc performance and share the same interface, small outline package and pin-out, providing an upward or downward component selection path based on performance, resolution, and cost.
FCOSL packages are available in small outline integrated circuits (SOIC), thin shrink small outline package (TSSOP), and quad flat package (xQFP) configurations.
The new 1-Gbit DRAM is packaged in a standard 400-mil, 66-pin Thin Small Outline Package (TSOP) or a 68-ball Fine-pitch Ball Grid Array (FBGA) for space-constrained applications.
bis modem device set includes the CX84100, which is packaged in a 28-pin thin shrink small outline package (TSSOP), and the CX20493 which is packaged in a 28-pin quad flat no-lead (QFN) package.
Higher parallel test capability of strip testing, combined with Sidewinder's industry leading throughput, also enables significant cost reductions in test, even for small outline package (SOP), quad flat no-lead (QFN) and other well established high volume packages," he added.
As with all Fairchild Optically Isolated Error Amplifiers, the FOD2742 incorporates an optocoupler, precision reference, and error amplifier into an 8-pin small outline package to provide isolated voltage feedback between the secondary and primary sides of power conversion circuits for control and regulation purposes.