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What does SECAP stand for?

SECAP stands for Semiconductor Equipment Consortium for Advanced Packaging

This definition appears somewhat frequently and is found in the following Acronym Finder categories:

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  • Business, finance, etc.

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We have 7 other meanings of SECAP in our Acronym Attic

Samples in periodicals archive:

com), a provider of screen printing and material deposition technology, has recently joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP, www.
March 4 /PRNewswire/ -- BTU International , a leading supplier of thermal processing solutions to the semiconductor packaging market, has joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP).
MUNICH, Germany -- Consortium Goal Achieved: High Volume and Cost Effective 300 mm Production Line Fully Operable The Semiconductor Equipment Consortium for Advanced Packaging (SECAP)(FWB:SMH)(GER:SMH) today announced that they will disband now that the consortium has successfully established 300 mm Wafer Level Packaging as a functional technology and full-volume production on the first installed wafer-bumping line is underway.
Business Editors/High-Tech Writers SAN FRANCISCO--(BUSINESS WIRE)--July 3, 2003 SECAP Brings High-Volume Production On Line; Takes Leadership Role in Real World 300 mm Packaging Technology The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) today announced it has successfully installed a 300 mm wafer bumping and wafer-level packaging (WLP) line at Unitive Semiconductor Taiwan (UST), located in Hsinchu, Taiwan.
Nasdaq: SMTL), a leading supplier of wafer surface preparation and electrochemical deposition (ECD) systems to the semiconductor industry, and a charter member of the Semiconductor Equipment Consortium for Advanced Packaging (SECAP), today announced the successful transition of the solder-bumping process to 300mm wafers.