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We have 11 other definitions for QDP
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Samples in periodicals archive:
This solves the well-known cross-tie stub problem associated with standard single, double and quad die packages used on double-sided assemblies by decreasing the distance the cross tie stubs must be routed in the breakout region.
The 4Gb OneNAND memory is a quad die package (QDP) developed by stacking four 1Gbit OneNAND memory chips in a 90 nanometer production process developed last November.
Using 90nm manufacturing process, the new high-speed 2Gb NAND flash will be available in 3 forms: single chip 2Gb, dual die package 4Gb, and quad die package 8Gb.