What does KGD stand for?

Known Good Die (semiconductor industry)

This definition appears very rarely and is found in the following Acronym Finder categories:

Science, medicine, engineering, etc.

Other Resources:

<< Previous	Abbreviation Database Surfer		Next >>
Klinisch Genetisch Centrum Nijmegen (Dutch: Clinical Genetics Center Nijmegen; Nijmegen, Netherlands) Karmann Ghia Club of North America (Oakland, CA) Kate Gleason College of Engineering (Rochester Institute of Technology; New York) Kulim Golf & Country Resort (Malaysia) Karmann Ghia Club Suedhessen (Germany) Kaliningrad, Russia - Kaliningrad Airport (Airport Code) Ketogenic Diet (epilepsy) Kilograms per Day King's Gambit Declined (chess) Kishimoto Gordon Dalaya PC (architectural firm)		Komitee Für Grundrechte Und Demokratie Korean Game Developers Association (Korea; video game developers group) Kernel Gnu DeBugger (linux, programming) Krajowa Grupa Doradztwa Majatkowego (Polish: The National Advisory Group Majatkowego; Warsaw, Poland) Kelab Golf Diraja Pahang (Malaysia) Kelab Golf Diraja Selangor (Malaysia) King George Dental University (India) Kansas Gas and Electric (Wichita, KS) Keller Ground Engineering Kingdom of God on Earth

Samples in periodicals archive:

1 at SEMI's Known Good Die Workshop in Santa Clara, CA.

Lowering Next-Gen silicon product cost: the impacts of design, ...

AMD developed the robust Known Good Die (KGD) program and the patented negative gate erase technology, and developed highly reliable Fine-pitch Ball Grid Array packaging.

AMD intros high-performance Flash memory device

The first product developed by the company as a result from the technology advancement is the Am29BL162C, a 16Mb Burst Mode Flash memory device based on the AMD Known Good Die (KGD) form factor.

AMD introduces enhanced Flash memory testing technology

The WDF 12DP is designed to address the wafer-level testing of these packaging technologies, as well as Known Good Die testing of ultra thin wafers, singulated wafers and strips on a dicing frame.

Tokyo Electron (TEL) Introduces a Dual Purpose 300mm Dicing Frame ...

Issues related to stacked die include wafer thinning, bare die, known good die (KGD), die attach and wire bond, and thermal dissipation.

3-D packaging gets ready for prime time: among the benefits: improved ...

Harmony WLBI is an important component in FormFactor's suite of probe card solutions for enabling known good die (KGD) applications, where devices must be tested to specification before packaging.

FormFactor Ships Industry's First One-Touchdown 300-mm Wafer Probe ...

Direct flip-chip die is the most efficient approach when the issues of known good die and board/assembly are resolved.