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Word(s) in meaning: chat  "global warming"
Postal codes: USA: 81657, Canada: T5A 0A7

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What does IEDM stand for?

International Electron Devices Meeting


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This definition appears very rarely and is found in the following Acronym Finder categories:

  • Information technology (IT) and computers
  • Science, medicine, engineering, etc.
  • Organizations, NGOs, schools, universities, etc.

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<< PreviousAbbreviation Database SurferNext >>
International Education Development Initiative (Japan)
International Electronic Data Interchange
International Estimated Daily Intake (exposure calculations)
Internet Electronic Data Interchange
Individual Equipment Decontamination Kit
Innerschweizer Erziehungsdirektorenkonferenz
Immunoreactive Endogenous Digoxin-Like Factor
Industry, Economic Development and Mines (Canada)
Information Exchange Data Model
Institute Économique de Montréal
Integrated Electronic Data Management System
International Electron Devices and Materials Symposium
Impuesto Especial sobre Determinados Medios de Transporte (Spanish)
Institut Européen de Négociation (French: European Institute of Negotiation)
Interactive Economic Development Network
Integrated Electronic Data Processing
International Executive Development Programmes (website; London, England, UK)
Internet Explorer Display Picture (software)
Irving Economic Development Partnership (Irving, TX)
IE Domain Registry (Ireland national country code top level domain registry)

Samples in periodicals archive:
Byline: pinto03 At this week's International Electron Devices Meeting (IEDM) here, IBM, Intel, TSMC and the NEC/Toshiba duo will separately present papers on 32-nm processes with high-k and metal gates.
Details of this technology were presented at the 2008 IEEE International Electron Devices Meeting (IEDM) held from December 15 to 17 in San Francisco.
Intel said it would further release details about the new 32nm process technology at the International Electron Devices Meeting next week in San Francisco.
At press time, Intel was scheduled to present details of its new process technology at the International Electron Devices Meeting.
More information about the memory cell, cross point array, experiment and results will be published in a joint paper titled "A Stackable Cross Point Phase Change Memory," and will be presented at the 2009 International Electron Devices Meeting in Baltimore, Md.
Details of the technology were presented at the 2008 IEEE International Electron Devices Meeting (IEDM) being held from December 15 to 17 in San Francisco.
Byline: shiv03 Intel will "extend its lead over AMD, IBM and other microprocessor vendors" at next week's ubergeekfest, the 2008 International Electron Devices Meeting (IEDM) in San Francisco.
December 15-17, 2008- 54th Annual IEEE International Electron Devices Meeting, Hilton San Francisco, 333 O'Farrell St.

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