com)-- Kaelus, a Smiths Interconnect business, announced today the launch of the next generation in a line of industry leading Passive Intermodulation (PIM) test equipment with the release of the iPA Series PIM Test Analyzer.
What does IM stand for?
IM stands for Intermodulation
This definition appears very frequently and is found in the following Acronym Finder categories:
- Information technology (IT) and computers
See other definitions of IM
We have 59 other meanings of IM in our Acronym Attic
- Interceptor Missile
- Interconnect Monitor
- Interest Management
- Interface Manager
- Interface Module
- Interface Multiplexer
- Interim Measure
- Intermediate Level Maintainer
- Intermediate Maintenance
- Intermediate Moisture (rations)
Samples in periodicals archive:
29, 2011 /PRNewswire/ -- Anritsu Company introduces the MW8209A PIM Master, an innovative passive intermodulation (PIM) analyzer that covers the 900 MHz band to address the growing need to measure PIM in E-GSM networks, including UMTS Band VIII and LTE Band 8.
com Anritsu Company has announced the introduction of the MW8219A PIM Master, a field test solution that can locate the source of passive intermodulation (PIM).
The DAC5687 delivers a signal-to-noise-ratio (SNR) greater than 75 dBFS and 3rd order intermodulation (IMD3) greater than 81 dBc while allowing multi- carrier systems to operate with higher output power.
Live demonstrations of the new iPA Portable Passive Intermodulation (PIM) test analyzer and showcasing low PIM Site Sharing and DAS Interface Solutions CENTENNIAL, Colo.
5 GHz, the R&S[R]PR100 is ideal for quickly detecting and locating the source of radio frequency interference (RFI), electrical interference and intermodulation interference disrupting wireless microphones.
Developed as part of Anritsu's recently introduced MW8219A PIM Master(TM), DTP addresses the growing need to measure Passive Intermodulation (PIM) due to the rollout of high-capacity platforms, such as HSPA+ and LTE.
The halogen-free laminate combines low-loss dielectric with low-profile copper foil for reduced passive intermodulation and low insertion loss.