Byline: datta003 Zuken completed a three-year European research project focused on improving the development process and modeling of new chip sets and dedicated high-density interconnect (HDI) that will bring major improvements to the company's high-speed design software, CR-5000 Lightning for Power Integrity analysis.
Proposed paper topics include: microelectronics applications; ceramics for future electronics; microvia, high-density interconnect (HDI) laminates; chip-scale package (CSP), flip chips, area array packages; advanced interconnect; integrated passives and system in package (SP); lead-free and halogen free electronics; MEMS, MOEMS and opto; and introducing new technologies to the production floor.
ESI's high-repetition UV laser drilling systems perform high-quality, high-volume drilling of blind microvias in advanced IC packages, such as flexible circuits and high-density interconnect (HDI).
The 744NT is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers, flat panel displays and other applications.
The 744NT is a large area, four-target, batch sputtering system, designed for processing high-density interconnect, 200 mm semiconductor wafers, flat panel displays and other applications.
NYSE:VSH) announced today that ceramic production for its high-density interconnects has reached the same level as before the fire that shut down the company's Electro-Films Inc.
Targeted at the high-density interconnect (HDI) market and the integrated circuit (IC) packaging market, the Model 5330 features a new higher-power diode-pumped laser that increases production throughput in IC packaging applications by more than 20%.
is a Dallas-based high-density interconnect (HDI) company that leverages advances in silicon, substrate, assembly and test capabilities to enable dramatic improvements in the packaging of and interconnection across semiconductors.
