What does FPBGA stand for?

Fine-Pitch Ball Grid Array

This definition appears very rarely and is found in the following Acronym Finder categories:

Science, medicine, engineering, etc.

Other Resources:

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Federation of Publishers and Book-Sellers Association of India (New Delhi; India) Four Point Bent Beam (materials) Fraksi Partai Bulan Bintang (Indonesian: Moon Star Party Faction; Islamic political party) Fairway Park Baptist Church (Hayward, CA) False-Positive Blood Culture Forest Park Baptist Church (Illinois) Freedom Party of British Columbia (Canada) Functional Plan Block Diagram Final Program and Budget Guidance FORSCOM Program Budget Guidance		Forum Persaudaraan Bangsa Indonesia (Indonesian: Indonesian Forum of the Brotherhood) Florida Premier Baseball League (Hollywood, FL) Force Protection Battlelab Fresh Peripheral Blood Lymphocytes Force Projection Battle Lab Support Element Force Projection Battle Lab Support Element (formerly EELS) Fetal Peripheral Blood Mononuclear Cells Family Planning Benefit Program (New York State Department of Health; Abany, NY) Framed Pseudo-Bayesian Priority Fundacja Porozumienie Bez Przemocy (Polish: Foundation for Nonviolent Communication)

Samples in periodicals archive:

AMD developed the robust Known Good Die (KGD) program and the patented negative gate erase technology, and developed highly reliable Fine-pitch Ball Grid Array packaging.

AMD intros the lowest power flash memory device for high-end cellular ...

The 65-nm 72-Mbit SRAMs are available in a standard 165-pin Fine-pitch Ball Grid Array (FBGA) package and are pin-compatible with existing 90-nm QDR and DDR devices for easy migration.

Cypress Unveils Market's First SRAM on 65-nm Process Technology

The new S5H1411 digital TV receiver chip is available in the 100-pin thin quad flat pack (14mm x 14mm) or 100-ball fine-pitch ball grid array (8mm x 8mm) packages.

Samsung Electronics Introduces Digital TV Receiver With Unprecedented ...

The 8-GB DDR DRAM module is available in two forms of package stack technology; a dual-stack of 1-Gb DDR DRAMs in thin small outline package (TSOP) or a quad-stack of 1-Gb DDR DRAMs in fine-pitch ball grid array (FBGA) package, otherwise referred to as a multi-stack package (MSP).

Samsung Electronics Introduces the Industry's Highest Density ...

The new device, which has already been supplied to leading graphics card manufacturers, adopts a JEDEC standard 144-ball Fine-pitch Ball Grid Array (FBGA) package.

Samsung Electronics Announces JEDEC-Compliant 256Mb GDDR2 for 3D ...

The new 1-Gbit DRAM is packaged in a standard 400-mil, 66-pin Thin Small Outline Package (TSOP) or a 68-ball Fine-pitch Ball Grid Array (FBGA) for space-constrained applications.

Infineon Samples the World's Smallest 1-Gbit Double Data Rate SDRAMs ...

AMD developed the robust Known Good Die (KGD) program and the patented negative gate erase technology, and developed highly reliable Fine-pitch Ball Grid Array (FBGA) packaging.

AMD Earns Samsung's ``Best Supplier'' Award for 2002

AMD developed the robust Known Good Die (KGD) program and the patented negative gate erase technology, and developed highly reliable Fine-pitch Ball Grid Array (FBGA) packaging.

AMD Appoints Sylvia Summers Vice President and General Manager of ...