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Samples in periodicals archive:
The IPC-4552 Specification for Electroless Nickel Immersion Gold [ENIG] Plating for Printed Circuit Boards is being updated.
The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG).
Early SMT emigrants from HASL adapted gold as surface finish - particularly electroless nickel immersion gold (ENIG) and immersion gold (ImAu).
The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG) and have solder spheres of 63/37 lead/tin or of lead-free SAC305 alloy.
Electroless nickel immersion gold (ENIG) fits that description pretty well.
Electroless nickel immersion gold has been around for some time and also has no impact at ICT related to fixture contact.
Advanced Circuits, the country's leading manufacturer of quickturn printed circuit boards, today announced that it has completed installation of its Electroless Nickel Immersion Gold (ENIG) plating line to meet customer demand for the latest in lead-free surface finish technology.
5, attached to electroless nickel immersion gold (ENIG) at the package interface.