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Active devices and components must be removed from their traditionally large packages and assembled directly onto a substrate designed to accept direct chip attach.
The simple handling in terms of tolerances compared to direct chip attach is the main advantage in using strap technology.
By only modifying the top metal layer, the chip design can be re-configured for flip-chip, wire-bond or direct chip attach interconnect solutions.
With this acquisition Mentor gains technology and additional expertise in multi-chip modules, hybrid, radio frequency, integrated circuit package, embedded component and direct chip attach design.
The die can then be placed directly face down onto the substrate as a flip chip on board or direct chip attach or assembled as a flip chip in package such as a BGA or CSP.
The Quad APS-1 Assembler is a flexible, high precision pick and place system that can be configured for a wide variety of advanced SMT and semiconductor die attach processes including Direct Chip Attach and Flip Chip Bonding on bismaleamide terapthallate BT, FR-4, Polyester, Polyimide, Lead Frame and Ceramic substrates.
ASAT's MSP family can accommodate conventional chip and wire processing with gold wire bonding, eutectic flip chip for direct chip attach, or "known good package" assembly utilizing QFN and other plastic packaging techniques.
Government's Microelectronics Research Lab to develop processes for the manufacturing of ultra-thin direct chip attach flip chip assemblies using commercial flex substrates.