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What does DCA stand for?

Direct Chip Attach


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This definition appears very rarely and is found in the following Acronym Finder categories:

  • Information technology (IT) and computers

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Samples in periodicals archive:
Active devices and components must be removed from their traditionally large packages and assembled directly onto a substrate designed to accept direct chip attach.
The simple handling in terms of tolerances compared to direct chip attach is the main advantage in using strap technology.
With this acquisition Mentor gains technology and additional expertise in multi-chip modules, hybrid, radio frequency, integrated circuit package, embedded component and direct chip attach design.
The flip chip bump process also enables STATS to participate in wafer scale packages, direct chip attach, and integrated passive devices.
Government's Microelectronics Research Lab to develop processes for the manufacturing of ultra-thin direct chip attach flip chip assemblies using commercial flex substrates.
The internal flip chip bump process enables Amkor to participate actively in the arena for direct chip attach, wafer scale package, and integrated passive device.
Technologies related to CSPs, direct chip attach (DCA) and small form factor components in mid-to low-end products are increasingly pervasive, calling for assembly platforms better suited for production in cost sensitive and medium-mix, medium-volume environments.
It addresses the requirements of emerging IC packaging options, such as high-density ball-grid arrays (BGAs), chip-scale packages (CSPs) and direct chip attach (DCAs).

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