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Acronymfinder

What does DPW stand for?

DPW stands for Dies Per Wafer


This definition appears very rarely and is found in the following Acronym Finder categories:

  • Science, medicine, engineering, etc.

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We have 60 other definitions for DPW in our Acronym Attic

Samples in periodicals archive:

Cost Analysis - Yield Hypotheses - LED Front-End Cost - Front-End : Epitaxy Cost - Front-End : Other Front-End Cost - Front-End : Cost per Equipment Family - Front-End : Cost per Consumable - Dies per Wafer & Probe Test - Back-End 0 : Probe Cost & Dicing - LED Die Cost - Back-End 1 : Packaging Cost & Final test - Component Manufacturing Cost 6.
Cost Analysis * Synthesis of the Cost Analysis * Yields Explanation * Hypothesis * LED Front-End Cost * Front-End : Epitaxy Hypotheses * Front-End : Epitaxy Cost * Front-End : Epitaxy Cost per Steps * Front-End : Other Front-End Cost * Front-End Cost per Equipment Family * Front-End Cost per Consumable Family * Dies per Wafer & Probe Test * Back-End 0 : Probe Cost * Back-End 0 : Dicing Cost * LED Wafer & Die Cost (FE + BE 0) * Back-End 1 : Packaging Hypothesis * Back-End 1 : Packaging Process Flow * Back-End 1 : Packaging Cost Details * Back-End 1 : Final Test Cost * Component Manufacturing Cost (FE+BE0+BE1) * Cost Analysis Evolution 5.
Cost Analysis * Synthesis of the Cost Analysis * Yields Explanation * Yield Hypotheses * LED Front-End Cost * Front-End : Epitaxy Hypotheses * Front-End : Epitaxy Cost * Front-End : Epitaxy Cost per Steps * Front-End : Other Front-End Cost * Front-End : Other Front-End Cost per Steps * Front-End Cost per Equipment Family * Front-End Cost per Consumable Family * Dies per Wafer & Probe Test * Back-End 0 : Probe Cost * Back-End 0 : Dicing Cost * LED Wafer & Die Cost (FE + BE 0) * Back-End 1 : Packaging Hypothesis * Back-End 1 : Packaging Process Flow * Back-End 1 : Packaging Cost Details * Back-End 1 : Final Test Cost * Component Manufacturing Cost (FE+BE0+BE1) * Cost Analysis Evolution 5.
Based on the evaluation done over the six months, we concluded that using PDF Solutions' software for optimizing wafer layout does indeed provide improvement over the currently used methods in terms of productivity measured by the litho cell throughput, while keeping the same number of good yielding dies per wafer.