What does CD stand for?

The value in web inspection is not in the detection of defects, but in the classification of defects, root cause analysis for process management and roll data analysis to optimize converting," Mr.

It is surprising, however, that ultrasonic NDT methods have not been more fully exploited in the casting industry, since they offer the following advantages: * the ability to locate types of defects that cannot be detected by other methods, such as thin horizontal cracks typical of cold shuts; * accurate determination of defect depth; * accurate determination of part thickness, which can be used to verify that tolerances are being met before production of a casting begins; * no danger to the operator; * lower equipment costs that other comparable methods; * portability, permitting field inspections; * potential classification of defects, i.

High-resolution camera-based systems provide accurate detection, sizing and classification of defects, including open and closed bubbles, black and white stones, scratches, and edge defects.

Nasdaq:EGLS), a leading supplier of process management tools for the semiconductor industry, today introduces a high-speed, automated optical inspection system for the identification and classification of defects on wafers with gold, bumped die contacts.

Two key elements of this suite are RTC(tm) for real-time classification of defects as the wafer is being inspected, and HRDC for high-resolution defect classification while the wafer resides on the inspector.

By establishing the SEMVision system's rule-based methodology for the automatic classification of defects, SEMATECH was able to create a common language for vendors and users based on eight Core Classes of defects.

amp;quot; By establishing the SEMVision system's rule-based methodology for the automatic classification of defects, SEMATECH was able to create a common language for vendors and users based on eight Core Classes of defects.

Use of the bright field channel also enables detection of additional irregularities, and will allow classification of defects such as scratches, slip lines and stacking faults -- a critical capability for wafer manufacturers.