18 degree Celsius per Watt and high avalanche energy rating of 4 Joules.
This enables the device to achieve very low thermal resistance of approximately 3 degrees Celsius per watt, and high efficiency ratings of 84 percent (at V(in) = 12V, V(out) = 1.
24 degrees Celsius per watt (C/W), which enhances the management of heat dissipation and helps reduce the heat sink size.
9 degrees Celsius per Watt allows space requirements to be reduced in portable electronics without increasing "hot spots.
9mOhm(max) at 10V gate-to-source voltage, and 1 degrees Celsius per watt thermal resistance to the PCB to deliver maximum current capability and efficiency.
In essence, the die is the package, and reduces thermal resistance from junction-to-PCB to 35 degrees Celsius/ per watt compared to more than 60 degrees Celsius per watt for SO-8 package devices.
The large-area contacts combined with the copper housing significantly improve heat dissipation compared to a plastic molded package: the junction-to-PCB thermal resistance is reduced to one degree Celsius per watt maximum, compared to 20 degrees Celsius per watt maximum for a standard SO-8 package.
The junction-to-case thermal resistance is among the best in the market with 60 degrees Celsius per watt.