What does BF stand for?

Bond Finger (semiconductor substrate type)

This definition appears very rarely and is found in the following Acronym Finder categories:

Information technology (IT) and computers
Science, medicine, engineering, etc.

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Samples in periodicals archive:

The design rules used were: * Bond finger--250 mm x 80 mm * Bond finger to die edge--80 mm * Bond finger pitch--125 mm * Trace width/space--35 mm/35 mm * Via size--80 mm * Via land size--200mm * Via to package edge--200 mm The wire-bond pattern was a challenge (FIGURE 6).

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Automatic Wire Bond Fanout - Library IQ automatically creates bond finger patterns based on input from Component IQ and Netlist IQ and wire bond design rules.

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