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Universities selected for early stage innovation grants and the names of their proposals are: ---Case Western Reserve University, Cleveland; "Heat rejection system for thermal management in space utilizing a planar variable-conductance heat pipe" ---Colorado State University, Fort Collins; "Computational approaches for developing active radiation dosimeters for space applications based on new paradigms for risk assessment" ---Georgia Institute of Technology, Atlanta; "Design and development of a next generation high capacity, light weight, 20-K pulse tube cryocooler for active thermal control on future space exploration missions" ---Pennsylvania State University, University Park; "Integrated control electronics for adjustable X-ray optics" ---Purdue University, West Lafayette, Ind.
We are excited to bring our active thermal control technology, long considered the benchmark for testing mid and high power processors, to new applications in the rapidly-expanding mobile market" said Luis Muller, President of Cohu's Semiconductor Equipment Group.
The CRAVE contract performs services for many different disciplines in the Johnson Space Center Engineering Directorate such as extravehicular activity (EVA) tools and equipment, technology development for advanced EVA, extravehicular robotics, environmental control and life support systems, active thermal control systems, flight crew equipment, and crew health care systems.
In these tight quarters, they rerouted a series of two electrical cables and four fluid quick disconnect lines from the soon-to-be defunct Early External Active Thermal Control System to a permanent cooling system in the Destiny Laboratory.
The Summit ATC is a Pick-and-Place IC handler that utilizes Active Thermal Control Technology for precise temperature conditioning and control of devices that require heat dissipation during test.
M4542AD Key Features The M4542AD Dynamic Test Handler features Advantest's newly developed Active Thermal Control (ATC) function, which maintains the pre-set surface temperature of the device during testing, allowing customers to test their devices at temperatures of anywhere from -60 to +150 degrees C.
Cohu's proven track record and industry leadership make it an excellent match for adding value to our advanced active thermal control technology offering.
He holds four patents covering the fabrication of microscopic 3D structures, shape memory alloy fibers with rapid contraction and expansion, dynamically reconfigurable hardware real-time control systems and active thermal control of surfaces.